描述

PP GF33复合芯片价格

产品名称：PP GF33复合芯片
形式：颗粒/颗粒
易燃性：HB填料：矿物填料
等级：注射成型、挤出成型等
颜色：按要求
认证：SGS、REACH、ROSH、FTA等

PP GF33复合芯片价格

产品详细信息

聚丙烯-GF33复合芯片

PP-GF33是玻璃纤维增强PP，比例为30%。GF是玻璃纤维的缩写，是指玻璃纤维，它是改性塑料常用的无机填料

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PP GF33 Compound Chips Price

Product Name : PP GF33 Compound Chips
Form : Granule/Pellet
Flammability : HBFiller : Mineral Filler
Grade : Injection molding,extrusion molding etc
Color : As Requirement
Certification : SGS ,REACH ,ROSH ,FTA etc

PP GF33 Compound Chips Price

Product Details

PolypropylenePP GF33 Compound Chips

PP-GF33 is glass fiber reinforced PP with a proportion of 30%. GF is the abbreviation of glass fiber, which refers to glass fiber, which is a commonly used inorganic filler for modified plastics.

Glass fiber has the characteristics of high tensile strength, large impact energy absorption, elastic coefficient, good heat resistance, and low price. It is often used as a reinforcing phase to produce polymer, rubber and other composite materials. PP has become one of the most commonly used plastics in the world due to its low cost, low density, corrosion resistance, stable processing and chemical properties, and recyclability. Its application involves various fields of production and life. However, due to its large shrinkage rate, easy cracking at low temperature, and poor stiffness and impact performance, its application is limited in some occasions, so glass fiber can be used to reinforce it, thereby reducing costs and optimizing mechanical properties.

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