描述

高流动性颗粒形成PC树脂共聚物

再生聚碳酸酯颗粒/PC颗粒CD/DVD PC性能的每吨PC树脂价格：·良好的电气绝缘性能，不受水或温度的影响·良好的耐磨性·耐重复蒸汽灭菌·比其他工程效率高

高流动性颗粒形成PC树脂共聚物

产品细节

高流动性颗粒形状PC树脂共聚物

PC激光雕刻材料LDS材料特性····································

塑料组件的电镀不会影响天线的特性和稳定性

产量增加，产品体积缩小，符合智能产品薄型化的发展趋势

设计开发时间短，可根据客户需求进行定制设计。·

可用于激光钻孔

与SMT工艺兼容

无需通过十字线。LDS塑料的加工过程·

LDS材料的注射成型：使用注射成型机模具成型塑料颗粒·

激光激活LDS注射成型零件：使用能量束升华选定的塑料区域，塑料零件的表面被锡防蚀剂烧掉，暴露封装在塑料中的金属化合物，以改善选择区域的化学镀效果

LDS产品线型的金属化：通过电镀处理，铜、镍、金等附着在激光激活区域，使塑料成为具有导电电路的中间组件

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High Flow Particles Shapes PC Resin Copolymer

Recycled polycarbonate pellet/ PC granules PC resin price per ton for CD/ DVD PC Properties : · Good electrical insulation properties, that are not influenced by water or temperature · Good abrasion resistance · Resistant to repeated steam sterilization · Efficient than other engineering…

High Flow Particles Shapes PC Resin Copolymer

Product Details

High flow particles shapes PC resin copolymer

PC laser engraving material LDS material characteristics ·

easy to modify during development, low proofing cost. ·

Plating of plastic components does not affect the characteristics and stability of the antenna. ·

The output is increased, and the product volume is reduced, which is in line with the development trend of smart product thinness. ·

The design and development time is short, and the customized design can be carried out according to customer needs. ·

Can be used for laser drilling. ·

Compatible with SMT process. ·

No need to pass through the reticle. Processing process of LDS plastics ·

Injection molding of LDS materials: The use of injection molding machine molds to shape plastic particles ·

Laser activation of LDS injection molded parts: Using energy beams to sublimate the selected plastic area, the surface of the plastic parts is burned off by the tin anti-etching inhibitor, exposing the metal compound encapsulated in the plastic to improve the chemical plating effect of the selection area. ·

Metallization of the line pattern of LDS products: Through electroplating treatment, copper, nickel, gold, etc. are attached to the laser-activated area, so that the plastic becomes a MID component with a conductive circuit.

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