描述

聚酰胺6.6 GF30 PA66芯片

产品名称：聚酰胺6.6 GF30 PA66芯片

类型：原始/回收

工艺：注塑

颜色：定制颜色

聚酰胺6.6 GF30 PA66芯片

产品详细信息

聚酰胺6.6 GF30 PA66芯片

PA66是一种机械强度高、应用广泛的PA系列。由于其高结晶度，它具有高硬度和耐热性

编辑本节的化学和物理性质

PA66在聚酰胺材料中具有较高的熔点。它是一种半结晶材料。PA66还可以在较高温度下保持强大的强度和刚度。PA66成型后仍具有吸湿性，吸湿性的程度主要取决于材料的组成、壁厚和环境条件。在产品设计中必须考虑吸湿性对几何稳定性的影响

Co立即接触聚酰胺6.6 GF30 PA66芯片

Polyamide 6.6 GF30 PA66 Chips

Product Name : Polyamide 6.6 GF30 PA66 Chips
Type : Virgin / Recycled
Process : Injection Molding
Color : Customized Color

Polyamide 6.6 GF30 PA66 Chips

Product Details

Polyamide 6.6 GF30 PA66 Chips

PA66 performance

PA66 plastic raw materials for translucent or opaque opalescent crystalline polymer, with plasticity. Density 1.15 g/cm3. Melting point is 252 ℃. The embrittlement temperature is -30℃. The thermal decomposition temperature is greater than 350℃. Continuous heat resistance 80-120℃, balanced water absorption rate 2.5%. Resistant to acid, alkali, most inorganic salt aqueous solutions, halogenated alkanes, hydrocarbons, esters, ketones, etc., but soluble in phenol, formic acid and other relative solvents. Excellent wear resistance, self lubricity and high mechanical strength. But the water absorption is large, so the dimensional stability is poor

PA66 is a variety of PA series with high mechanical strength and wide application. Because of its high crystallinity, it has high rigidity and heat resistance.

Edit the chemical and physical properties of this section

PA66 has a higher melting point in polyamide materials. It is a semicrystalline – crystalline material. PA66 can also maintain strong strength and stiffness at higher temperatures. PA66 still has hygroscopicity after molding, the degree of which mainly depends on the composition of the material, wall thickness and environmental conditions. The influence of hygroscopicity on geometric stability must be considered in product design.

In order to improve the mechanical properties of PA66, various modifiers are often added. Glass is a common additive, and sometimes synthetic rubber, such as EPDM and SBR, is added to improve impact resistance.

PA66 is less viscous and therefore very fluid (but not as fluid as PA6). This property can be used to manufacture very thin components. Its viscosity is very sensitive to temperature changes. The shrinkage rate of PA66 is between 1% and 2%, adding glass fiber additive can reduce the shrinkage rate to 0.2%~1%. The difference of shrinkage rate in the flow direction and in the direction perpendicular to the flow direction is great.

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