描述
无机填充PPS芯片
无机填充PPS芯片
聚苯硫醚塑料，
注射/挤出级PPS树脂，
颜色任何颜色都可用，
优点高抗冲击性，易于成型，
玻璃纤维增强碳纤维增强，
阻燃级，增韧级，
包装25kg/袋（也可定制）
无机填充聚苯硫醚芯片
产品详细信息
| 材质 | 无机填充聚苯硫醚芯片Modle | KY-TR6001 | 类型 | 颗粒、颗粒、塑料颗粒、夹子、颗粒 |
| 填充 | <玻璃纤维、碳纤维、caco3、Tac、PTFE、玻璃珠、Mos2等 | |
| 颜色 | 根据需要 | 5%-60% |
| 抗紫外线、耐寒、耐热、增韧、高冲击、玻璃纤维/碳纤维增强等 |
无机填充PPS芯片的分类包括：玻璃纤维（GF5%-60%）增强级、玻璃纤维和非极性填料复合增强级、碳纤维增强级、钢化级
主要特点：
优良的流动性， 优良的尺寸稳定性 用途：广泛应用于电子电器、汽车及工业产品中的高耐热性、高刚性、耐冲击性和电气性能配件 无机填充聚苯硫醚芯片的更多细节如果您对纽约感兴趣，请与我联系，我们将进一步讨论，并发送我们的专业计划供您参考<br/>
Inorganic Filled PPS Chips
Inorganic filled PPS chips
Polyphenylenesulphide plastic,
PPS resin for injection/extrusion grade,
Color Any color is available,
Advantage High impact resistance, easily molding,
Galss fiber reinforced carbon fiber reinforced,
Fire retardant grade, toughen grade,
Packing 25kg/bag(also customizable).
Inorganic Filled PPS Chips
Product Details
| Material | Inorganic filled PPS chips |
| Modle | KY-TR6001 |
| Type | granules，pellets，plastic granule,clips,particle. |
| Filler | fibre galss , carbon fiber, caco3, Tac, PTFE ,glass bead,Mos2 and so on. |
| Color | As required |
| Filler content | 5%-60% |
| Anti-UV, Cold resistance,heat resistance,toughen,high impact ,glass/carbon fiber reinforeced and so on. | |
Inorganic filled PPS chips
The classification of inorganic filled PPS chips includes: glass fiber (GF5%-60%) reinforced grade, glass fiber and non-polar filler composite reinforced grade, carbon fiber reinforced grade, toughened grade.
Main features:
High rigidity, high mechanical properties,
High heat resistance,
Engage in electrical performance,
High toughness,
VO grade flame retardant performance,
Excellent liquidity,
Excellent dimensional stability.
Application: It is widely used in high heat resistance, high rigidity, impact resistance and electrical performance accessories in electronic appliances, automobiles, and industrial products.
More detail of Inorganic filled PPS chips.Any interested in, pls kindly contact with me, we will talk further and send you our professional plan for your reference.
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